发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board having less short circuit defect between electrically conductive circuits and good circuit formability. SOLUTION: The problems are solved by providing an etching method where, when two or more same kinds of metals manufactured by different processes are selectively etched, etching is conducted by using a reaction-limiting etchant, and by providing a manufacturing method of the printed circuit board using the method. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007150366(A) 申请公布日期 2007.06.14
申请号 JP20070060815 申请日期 2007.03.09
申请人 HITACHI CHEM CO LTD 发明人 TAKAI KENJI;URASAKI NAOYUKI;ITO TOYOKI;ARIGA SHIGEHARU;NAKASO AKISHI;ENDO TOSHIHIRO
分类号 H05K1/02;H05K3/06;H05K3/18;H05K3/24 主分类号 H05K1/02
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