| 摘要 |
PROBLEM TO BE SOLVED: To provide a hermetically sealed electronic component which copes with the unleading of the outer surface of the electronic component and is hermetically sealed with low cost and without deteriorating the inserting and fitting the characteristics when a base is to be pressure-fitted into a cap and the connectability with outer terminals. SOLUTION: The electronic component is composed of a base 1 with a lead terminal piercing and fixed to glass, an electronic element 2 mounted on the base 1, and a cap 3 pressure-fitted into the base 1 to hermetically seal the electronic element. A high-temperature solder film is formed on the lead terminal surface shed in the cap and the base surface with the cap closely bonded to the base by pressure fitting, and a lead-free metal film for improving the bonding power of a metal solder is formed on the lead terminal surface exposed to the outside from the cap, and the high-temperature solder film is formed only in the inside of the cap. COPYRIGHT: (C)2007,JPO&INPIT
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