| 摘要 |
PROBLEM TO BE SOLVED: To provide a small and light wiring board and its manufacturing method, as well as a manufacturing method of electronic components using the wiring board and its device. SOLUTION: In a wiring board which laminates conductor wiring (die pad 105, circuit pattern 104) on an insulating film 101, the insulating film 101 consists of resin films with thickness of 40μm or less. An opening 124 which penetrates the insulating film 101 in a thickness direction is formed in the wiring section of external wiring of the insulating film 101, and a reinforcement film 122 is laminated via adhesives which can be exfoliated in the opposite side of the insulating film 101. COPYRIGHT: (C)2007,JPO&INPIT
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