| 摘要 |
PROBLEM TO BE SOLVED: To secure the solder height of a lead terminal which is an electrode portion and an external substrate without being affected by the solder height of an island, in a semiconductor device in which a semiconductor element mounted on the island is electrically connected to a lead terminal, and they are sealed by mold resin so as to expose the lower plane of the island, and are soldered with the external substarte at this exposed plane. SOLUTION: In the semiconductor device 100, a semiconductor element 20 is mounted on the upper plane 11 of the island 10, the semiconductor element 20 disposed at the periphery of the island 10 and the electrically connected lead terminal 30 are sealed by a molded resin 40, the lower plane 12 of the island 10 and the lower plane 32 of the lead terminal 30 are exposed from a lower plane 42 of the mold resin 40, and soldering with an external substrate is carried out in these exposed plane 12, 32. The lower plane 12 of the island 10 is protruded farther downward than the lower plane 32 of the lead terminal 30. COPYRIGHT: (C)2007,JPO&INPIT
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