| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching method for a semiconductor wafer which improves flatness and nano topography. SOLUTION: In the etching method of the semiconductor wafer, a plurality of semiconductor wafers are held in a state that plate surfaces are kept opposed to each other to effect etching while rotating them. A rotary member is arranged between the semiconductor wafers. COPYRIGHT: (C)2007,JPO&INPIT
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