| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing circuit boards whereby the varying of the shapes of conductor patterns is suppressed without forming separately any current applying layer. SOLUTION: The method includes: a plating-mask forming step of forming a conductor layer 11 on an insulating substrate 2 and forming plating masks 12 on the conductor layer 11; an electrolytic-plating step of forming in succession first and second coating layers 4a, 4b by an electrolytic plating treatment in the non-forming regions of the plating masks 12 which are the portions of the surface of the conductor layer 11; a conductor-patterning-mask forming step of forming conductor patterning masks 13 on the conductor layer 11 and the first and second coating layers 4a, 4b after removing the plating masks 12; and an etching step of so removing by etching the portions of the conductor layer 11 which are present under the non-forming regions of the conductor patterning masks 13 as to form conductor patterns 3. COPYRIGHT: (C)2007,JPO&INPIT
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