| 摘要 |
A semiconductor device ( 20 ) in which a semiconductor element ( 2 ) is mounted on one of a front side and a back side of a wiring board ( 3 ), and a plurality of lands ( 9 )( 23 ) for external connection are provided on the other side of the wiring board, the land ( 9 )( 23 ) including a land terminal ( 10 )( 24 ) formed on the wiring board and a spherical solder ball ( 11 )( 25 ) formed on the land terminal, wherein a first land ( 23 ) immediately below an outer end corner (B) of the semiconductor element ( 2 ) is larger in size than the other lands ( 9 ).
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