Capacitive panel device manufacturing method, involves forming parts of conductive path layer and/or structured conductive path layer with electronic components and/or electronic switching devices and/or pin-and socket connectors

摘要

The method involves providing a front plate (1) from a partially transparent material. A coating (2) for forming panel labeling (2a, 2b) is directly formed at a rear side of the plate or partially formed by a partially transparent binder layer. A structured conductive path layer (5) is formed at a rear side of a conductive path layer (3) for forming capacitively activatable sensor units by parts of the layer (3) and/or layer (5). The parts are contactably formed with electronic components (12) and/or electronic switching devices (13) and/or pin-and socket connectors. An independent claim is also included for a capacitive panel device having a front plate from a transparent material.