| 摘要 |
An apparatus and a method for controlling a nozzle position are provided to match a nozzle hole to the center position of a wafer by setting a reference value when a hole position of each nozzle matches to a wafer center. A wafer(W) is placed on a chuck(102). Nozzles(112-114) spray a liquid chemical onto the wafer. A wafer center position sensor(130) detects the center position of the wafer. A nozzle hole position sensor(120) detects a hole position of the nozzle. A control unit sets a reference value by matching the wafer center position nozzle to the nozzle hole position sensor on a vertical line. The control unit determines whether the wafer center position sensor and the nozzle hole position sensor corresponding to the driven nozzle are matched to each other on the vertical line by driving the nozzle to control the position of the nozzle.
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