| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of elements capable of reducing open failure of a wiring pattern, poor shorting between wiring patterns in the same layer, and defective conduction between wiring layers. SOLUTION: The manufacturing method of elements includes a process for sequentially exposing a photosensitive resist film formed on a substrate 1 for each specified range. It includes a laminating process for forming insulating layers 5 and 18 or conductor layers 12 and 26 on the substrate, a resist film forming process for forming a resist film on the conductor layer if, for example, the conductor layer has been formed in the laminating process, and an exposure process for sequentially exposing the resist film for each specified range. The surface of the insulating layer or conductor layer in each specified range is a continuous and almost flat surface. COPYRIGHT: (C)2007,JPO&INPIT
|
