| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device which reduces the possibility of the occurrence of melting connection failures, as compared to conventional cases and can improve the reliability and productivity. <P>SOLUTION: According to the manufacturing method for the semiconductor device, a first connection terminal is connected to a second connection terminal by a heating process, where a solder bump is melted by exposing it to a temperature higher than the melting point of the solder bump; and during the heating process, the solder bump is exposed at least twice or more times, to a temperature higher than the melting point of the solder bump, and is cooled at least twice or more times to a temperature lower than the melting point of the solder bump. <P>COPYRIGHT: (C)2007,JPO&INPIT |
