发明名称 DEFECT INSPECTION METHOD AND SUBSTRATE INSPECTION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate inspection device capable of inspecting defects of a sample with good throughput and high accuracy. SOLUTION: The substrate inspection device 1 comprises a working chamber 30 in vacuum state, an electron-optical device 70 equipped with an LaB<SB>6</SB>electron source, a loader housing 40, which carries out/in a wafer to/from the working chamber, and a mini-environment device 20, which is connected to the working chamber and in which atmosphere is controlled. A loader housing 40 comprises a first loading chamber connected to the mini-environment device 20, a second loading chamber connected to the working chamber, a first shutter device 27 that selectively prevents communication between the first and second loading chambers, and a second shutter device 45 that selectively prevents communication between the second loading chamber and the working chamber. A vacuum exhaust pipe and a vent pipe for inert gas are connected to the first and second loading chambers, respectively. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007147648(A) 申请公布日期 2007.06.14
申请号 JP20070031703 申请日期 2007.02.13
申请人 EBARA CORP 发明人 KANEUMA TOSHIFUMI;SATAKE TORU;KARIMATA TSUTOMU;WATANABE KENJI;NOMICHI SHINJI;MURAKAMI TAKESHI;HATAKEYAMA MASAKI;NAKASUJI MAMORU;SOFUGAWA TAKUJI;YOSHIKAWA SEIJI;OWADA SHIN;NISHIFUJI MUTSUMI
分类号 G01N23/225;H01J37/18;H01J37/20;H01L21/66;H01L21/677 主分类号 G01N23/225
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