| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface-protection tape having improved heat-resistance, flexibility to enable sufficient absorption of pressure, free from sticking trouble to a heating table and having good adhesiveness to the circuit surface of a semiconductor wafer and a method for processing a semiconductor wafer by using the surface-protection tape. SOLUTION: The heat-resistant surface-protection tape 4 is composed of a substrate film 1 having a radiation-curable adhesive layer 2a cured by radiation and formed on one surface of the substrate film and an adhesive layer 3 formed on the reverse surface of the substrate film. The semiconductor wafer processing method comprises pasting of the heat-resistant surface-protection tape 4 to the semiconductor wafer 6 in a manner facing the adhesive layer 3 to the circuit pattern 5 surface of the wafer 6, grinding the semiconductor wafer 6, and pasting a die bond sheet 8 to the ground surface by placing the wafer on a heating table 7 facing the surface pasted with the heat-resistant surface-protection tape 4 downward. COPYRIGHT: (C)2007,JPO&INPIT
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