发明名称 METHOD OF REMOVING FILM PART
摘要 PROBLEM TO BE SOLVED: To provide a method of removing a film part which is not generating any remaining containing dirty water or the like but also capable of simply and rapidly removing the film part, and also to provide a method of removing the film part superior in removing property and easy to treat the remaining. SOLUTION: In the film part 1 consisting of a resin wax, to which a solvent has been applied, and the like, an organic and/or an inorganic powder 3 are applied to the film part which is dissolved and softened with the solvent and has a tackiness a little, the film part 1 is rubbed with an abutting body 5 such as a rotary brush, a brush or a pad together with the powder 3 to attach and/or admix the powder to/with the film part 1 to remove the tackiness in the film part 1, and also, the film part 1 containing the powder 3 is crushed or pulverized into small pieces 7 having no tackiness to be easily removed from a fixed surface 10 such as a floor 9 surface. Also, beside removing the tackiness in the film part, the film part 1, which has been increased in volume by the powder 3, is made weaker, the film part containing the powder 3 is crushed and/or pulverized into small pieces 7 having no tackiness to be removed from the fixed surface 10 such as the floor 9. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007144380(A) 申请公布日期 2007.06.14
申请号 JP20050370782 申请日期 2005.11.25
申请人 RISUDAN CHEMICAL:KK 发明人 YAMANAKA MINORU
分类号 B08B7/04;B08B1/04 主分类号 B08B7/04
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