| 摘要 |
A suppression method for suppressing a via stub effect of a substrate is disclosed. The suppression method is applicable to a substrate having a via, a first conductive line and a second conductive line connected through the via to the first conductive line. The suppression method includes changing a first width of a first conductive segment of the first conductive line connected to the via, and changing a second width of a second conductive segment of the second conductive line connected to the via, so as to change impedances of the first conductive line and the second conductive line to match with a stub impedance of the via, reduce a parasite impedance of the via stub, reach an impedance match at a designed frequency point, and improve an integrity of a signal after traveling from the first conductive line, the via and the second conductive line.
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