| 发明名称 |
Patterning of Substrates with Metal-Containing Particles |
| 摘要 |
The present invention relates to process for patterning metal-containing particles on or in a substrate. The present invention also relates to a non-etched substrate having metal-containing particles patterned thereon.
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| 申请公布号 |
US2007134902(A1) |
申请公布日期 |
2007.06.14 |
| 申请号 |
US20060608496 |
申请日期 |
2006.12.08 |
| 申请人 |
THE CURATORS OF THE UNIVERSITY OF MISSOURI |
发明人 |
BERTINO MASSIMO;LEVENTIS NICHOLAS;TOKUHIRO AKIRA;ZHANG GUOHUI |
| 分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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