Multichip stacking structure

摘要

A multichip stacking structure is provided, including a chip carrier; a plurality of semiconductor chips stacked on the chip carrier in a stepped manner that an overlying chip mounted on an underlying chip of the plurality of semiconductor chips has a suspended portion free of being in contact with the underlying chip; and a bump mounted on the chip carrier at a position corresponding to a suspended side of the stacked semiconductor chips where the suspended portion of the overlying chip is located. The bump can serve as a blocking member or a filling member to prevent the semiconductor chips from delamination or formation of voids during a molding process.