| 摘要 |
<p>Method and apparatus for heating articles in the vapor phase, particularly for soldering electronic components, uses at least one heat-transfer fluid (1) with a fixed b. pt. so that a controlled transfer of heat occurs in at least one treatment chamber (6). Method and apparatus for heating articles in the vapor phase, particularly for soldering electronic components, uses at least one heat-transfer fluid (1) with a fixed b. pt. so that a controlled transfer of heat occurs in at least one treatment chamber (6). It comprises: (A) heating in (6) to a low energy level (radiant heating) by circulation of flowing (1); (B) (1) can flow over a rough or ribbed surface to generate additional convective heat (more efficient warming to the low energy level); (C) heating in (6) to a higher energy level by evaporation of (1) to vapor (2); (D) by controlling the flow and heat output in the flow of (1), it is possible to control both the type (energy level) and amount of heating; (E) by combining one or several energy levels in (6) and the effective time of products (7) being heated, heating of (7) is controlled; (F) during heating in (6), (1) rinses flux residues through outlet (15), so cleans (6); and (G) the same (1) can, via a cooled flow (18), condense vapor (2), to bring (6) to the lower energy level, and the hot condensate is discharged from the chamber with the same flow of liquid, via outlet (15).</p> |
