FLIP-CHIP-Montageverfahren

摘要

The present invention is to provide a flip chip mounting method which does not cause void formation between a semiconductor chip and a substrate, and in the flip chip mounting method, the method comprising the steps of: (A) drying the substrate; and (B) at least one step of: (1) dispensing uncured sealant at least at a bump pressing portion on the surface of the substrate and/or the entire portion of the substrate where minute irregularities are present; and (2) performing a pressing and the curing of the underfill while maintaining the temperature conditions so that a temperature difference between the semiconductor chip and the substrate does not cause convection substantially in the uncured or curing underfill.