| 摘要 |
PURPOSE: A semiconductor package and a method for sealing the same are provided to prevent flow of a liquid sealant to ball lands or undesired regions of a printed circuit board. CONSTITUTION: A plurality of input and output pads(1a) are formed on the first semiconductor chip(1). A printed circuit board(10) is adhered to the first semiconductor chip(1) by an adhesive member(2). A solder mask(11) is formed on the printed circuit board(10). A plurality of wiring patterns including ball lands are formed on a lower face of the solder mask(11). A resin layer(15) is formed on a lower face of the wiring patterns. A plurality of bond fingers(13) are formed on a lower face of the resin layer(15). The bond fingers(13) are connected with the wiring patterns through a conductive via hole(14). A sealant flow prevention ring(28) is formed on the resin layer(15) between the bond fingers(13) and the ball lands. Conductive balls(40) are fused on each ball land. |
