| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive tape for dicing/die bonding which can have a sufficient adhesive force to avoid chip scattering between dicing frames and can prevent die cracking when a die is extracted. SOLUTION: The adhesive tape comprises a base layer 1, an adhesive layer (A) formed on the base film 1, a base layer 3 formed on the adhesive layer (A), an adhesive layer (B) formed on the base layer 3, and an adhesive layer 4 formed on the adhesive layer (B). An adhesive force between the adhesive layer (A) and a dicing frame is set at 0.6 N/25 mm or higher, and an adhesive formed between the adhesive layer (B) and the adhesive layer 4 is set at 0.05-0.5 N/25 mm. COPYRIGHT: (C)2007,JPO&INPIT |
