| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board capable of reducing effects of stress occurring due to a thermal expansion coefficient difference in between an electronic component to be mounted, while preventing insulation deterioration in an insulating member and disconnection or the like of a wiring pattern, and to provide a circuit board manufacturing method. <P>SOLUTION: The circuit board 10 is provided with a plurality of the wiring patterns 11 laminated via the insulating member 12 having a glass cloth 12a and an insulating resin 12b so as to be electrically connected with each other. A plurality of the wiring patterns 11 are respectively provided with a mounting wiring pattern 11a onto which the electronic component 20 is mounted via an electrical connection member 30, and an opposite wiring pattern 11b oppositely arranged to the mounting wiring pattern 11a. A mounting part insulating member (A) between the mounting wiring pattern 11a and the opposite wiring pattern 11b in the insulating member 12 is composed so that the glass cloth 12a is arranged deviatedly to the counter wiring pattern 11b side in a thickness direction of the circuit board 10. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
