| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a via array capacitor to be built in a wiring board which can be prevent damage even if the thickness is reduced by improving its strength. <P>SOLUTION: This via array capacitor 101 to be built in a wiring board is built in a build-up layer. The via array capacitor 101 has metal containing layers 111, 112, 121 and 122 to be arranged on a first main surface 102 and a second main surface 103. Meanwhile, the sum of a thickness B1 of the metal containing layers 111, 112 arranged on the first main surface 102 and a thickness B2 of the metal containing layers 121, 122 arranged on the second main surface 103 is 50% of a thickness A of the entire thickness of the via array capacitor 101. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
