| 摘要 |
PROBLEM TO BE SOLVED: To provide a partial soldering method and a partial soldering device which allow the flux to be applied and flow solder to be adhered only on necessary portions of a printed circuit board. SOLUTION: Below a transport device which runs the printed circuit board, a fluxer, a pre-heater, and a jet solder tank are disposed, and a spray nozzle, a heating section, and a jet nozzle corresponding to the necessary portions for soldering on the printed board are disposed at a predetermined interval. The necessary portions for soldering take the same positions as those of the spray nozzle, the heating section, and the jet nozzle by moving the printed board by a predetermined distance with the aid of a pusher, so that any flux and any molten solder are prevented from adhering to any unnecessary portion. COPYRIGHT: (C)2007,JPO&INPIT |
