| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin excellent in dielectric properties, in particular, having further improved permittivity and dielectric loss as compared with prior art, and to provide a composition containing the same and a molded article obtained from the same. SOLUTION: The thermosetting resin comprises a polymer having a dihydrobenzoxazine ring structure represented by general formula (I) in a main chain. There are provided a method of producing the same, a thermosetting composition containing the resin, a molded article obtained from the same, and electronic equipment containing the molded article. In the formula (I), Ar denotes a quadrivalent aromatic group; R<SP>1</SP>denotes an organic group having a siloxane group, wherein the part linked to the N atom in the formula (I) is an aliphatic (including alicyclic) hydrocarbon group; and n denotes an integer of 2-500. COPYRIGHT: (C)2007,JPO&INPIT
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