| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated packaged structure capable of reducing its height and achieving high-density packaging by inserting sheet-like electronic components between a circuit board and a semiconductor element for packaging. SOLUTION: The laminated packaging structure comprises the circuit board 1 where at least conductive wiring, a first connection terminal 2, and a second one 3 are formed; the semiconductor element 6 connected to the first connection terminal 2 on the circuit board 1 by a bump electrode 7; and the sheet-like electronic components 4 having an external connection terminal 5, while thin-film electronic components for composing the electronic component of the circuit board 1 are formed. The sheet-like electronic components 4 are arranged on the surface of the circuit board 1 for packaging the semiconductor element 6, the external connection terminal 5 and the second one 3 are connected, and the connecting distance between the bump electrode 7 of the semiconductor element 6 and the first connection terminal 2 is longer than the height of the sheet-like electronic components 4 packaged on the circuit board 1. COPYRIGHT: (C)2007,JPO&INPIT
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