发明名称 HIGH DENSITY POWER DISTRIBUTION UNIT
摘要 A power distribution unit (306) may include a power distribution unit frame (310), where the power distribution unit frame has a 2U form factor (312), and where the power distribution unit frame is coupled to mount in an embedded computer frame (102). A plurality of power ingress sites (330) may be coupled to a rear portion (320) of the power distribution unit frame, where each of the plurality of power ingress sites has a current capacity of at least 100 amperes, where each of the plurality of power ingress sites includes an ingress pin (332) coupled to interface with an ingress in-line, hyperboloid radial socket (334), and where the power distribution unit has a current capacity density of the plurality of power ingress sites of at least 600 amperes per power distribution unit.
申请公布号 WO2006107443(A3) 申请公布日期 2007.06.14
申请号 WO2006US06139 申请日期 2006.02.21
申请人 MOTOROLA, INC.;KELLY, JOHN, H.;NAUFEL, NAUFEL, C.;BORUCKI, IRENA;PILAT, EUGENE, R.;TEGETHOFF, MARKUS 发明人 KELLY, JOHN, H.;NAUFEL, NAUFEL, C.;BORUCKI, IRENA;PILAT, EUGENE, R.;TEGETHOFF, MARKUS
分类号 H05K7/02 主分类号 H05K7/02
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