| 摘要 |
<P>PROBLEM TO BE SOLVED: To stably form a protective film on exposed surfaces of embedded interconnects with good selectivity for thereby allowing recovery and protection of the interconnects. <P>SOLUTION: The electroless plating apparatus includes magnetic removal portions 356, 362 for magnetically removing small magnetic suspended solids in an electroless plating solution which have not been removed by a filter 305. Therefore, the small magnetic suspended solids in the electroless plating solution are prevented from being deposited on the surface of an insulating film or the like and from producing abnormal precipitates, and the properties of the electroless plating solution are rendered constant for a stable plating reaction. <P>COPYRIGHT: (C)2007,JPO&INPIT |
