发明名称 SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a micromachine which is reduced in cost, and increased in value added, by shortening a time period necessary for sacrifice layer etching, and preventing a structural layer from adhering to a substrate after the sacrifice layer etching, i.e. by improving throughput and yield. SOLUTION: The micromachine has a plurality of structures different in function from each other. In a process of manufacturing the micromachine, etching of the sacrifice layer 101 is conducted in multiple steps. Out of the multiple steps of the sacrifice layer etching, a sacrifice layer section that does not overlap the structural layer 102 is removed in the former sacrifice layer etching, and a sacrifice layer section that is under the structural layer is removed in the latter sacrifice layer etching. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007144611(A) 申请公布日期 2007.06.14
申请号 JP20060283282 申请日期 2006.10.18
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAGUCHI MAYUMI;IZUMI KONAMI
分类号 B81C1/00;B81B7/02;H01F41/04 主分类号 B81C1/00
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