发明名称 REFLOW SOLDERING TOOL
摘要 PROBLEM TO BE SOLVED: To provide a technique capable of improving positional precisions accuracy of parts after completion of soldering while preventing parts and a tool from being damaged. SOLUTION: The reflow soldering tool 10 is installed to a predetermined position with respect to the heat radiation plate 1 and is provided with a positioning opening 3 for positioning the parts 2 to be soldered to the heat radiation plate 1. An elastic deformation section 4, which comes into contact with the end face (outer end face 2a) of the part 2 and is elastically deformed by the load received from the part 2, is provided around the positioning opening 3. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007144450(A) 申请公布日期 2007.06.14
申请号 JP20050341004 申请日期 2005.11.25
申请人 TOYOTA MOTOR CORP 发明人 FUJITA NAMI;TORIYAMA KEN
分类号 B23K3/00;B23K101/42 主分类号 B23K3/00
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