发明名称 PROCESSING APPARATUS FOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a processing apparatus which washing a substrate without damaging it by preventing the temperature of processing liquid given ultrasonic vibrations from rising. SOLUTION: The processing apparatus for substrate which processes the substrate with the processing liquid given ultrasonic vibrations is equipped with an oscillation body 32, which is a rectangular parallelepiped and has an opening on a reverse surface of one length-directional end, and a supply path 35 for processing liquid formed obliquely to the other length-directional end part; a vibrator 34 which vibrates the oscillation body provided on the top surface of the oscillation body with an ultrasonic wave; and a heat exchanger which cools the processing liquid supplied to the supply path. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007150172(A) 申请公布日期 2007.06.14
申请号 JP20050345580 申请日期 2005.11.30
申请人 SHIBAURA MECHATRONICS CORP 发明人 KUROKAWA SADAAKI;HIGUCHI KOICHI
分类号 H01L21/304;B08B3/10;B08B3/12;G02F1/13;G02F1/1333 主分类号 H01L21/304
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