发明名称 |
PROCESSING APPARATUS FOR SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a processing apparatus which washing a substrate without damaging it by preventing the temperature of processing liquid given ultrasonic vibrations from rising. SOLUTION: The processing apparatus for substrate which processes the substrate with the processing liquid given ultrasonic vibrations is equipped with an oscillation body 32, which is a rectangular parallelepiped and has an opening on a reverse surface of one length-directional end, and a supply path 35 for processing liquid formed obliquely to the other length-directional end part; a vibrator 34 which vibrates the oscillation body provided on the top surface of the oscillation body with an ultrasonic wave; and a heat exchanger which cools the processing liquid supplied to the supply path. COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007150172(A) |
申请公布日期 |
2007.06.14 |
申请号 |
JP20050345580 |
申请日期 |
2005.11.30 |
申请人 |
SHIBAURA MECHATRONICS CORP |
发明人 |
KUROKAWA SADAAKI;HIGUCHI KOICHI |
分类号 |
H01L21/304;B08B3/10;B08B3/12;G02F1/13;G02F1/1333 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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