发明名称 PALLADIUM COMPLEX AND CATALYST-IMPARTING TREATMENT SOLUTION USING THE SAME
摘要 <p>The object is to provide a technique for forming a selective metal coating film on a non-conductive resin by allowing a catalyst metal to adsorb selectively onto an anionic group (e.g., a carboxyl group) on the resin. Thus, disclosed are: a palladium complex represented by the formula (I) below or a structural isomer thereof; a catalyst-imparting treatment solution for electroless plating, comprising the palladium complex or the isomer as an active ingredient; and a method for formation of a metal plating coating film on a non-conductive resin, comprising the steps of subjecting a non-conductive resin having an anionic group formed on its surface to a catalyst-imparting treatment with the catalyst-imparting treatment solution and then performing reduction treatment, electroless metal plating and electrolytic plating. (I) wherein L represents an alkylene group; and R represents an amino group or a guanidyl group.</p>
申请公布号 WO2007066460(A1) 申请公布日期 2007.06.14
申请号 WO2006JP321941 申请日期 2006.11.02
申请人 EBARA-UDYLITE CO., LTD.;KOHTOKU, MAKOTO;HAMADA, MIKA 发明人 KOHTOKU, MAKOTO;HAMADA, MIKA
分类号 C23C18/28;C07C229/08;C07C229/22;C07C229/24;C07C229/26;C07C279/14;C07F15/00 主分类号 C23C18/28
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