发明名称 |
PALLADIUM COMPLEX AND CATALYST-IMPARTING TREATMENT SOLUTION USING THE SAME |
摘要 |
<p>The object is to provide a technique for forming a selective metal coating film on a non-conductive resin by allowing a catalyst metal to adsorb selectively onto an anionic group (e.g., a carboxyl group) on the resin. Thus, disclosed are: a palladium complex represented by the formula (I) below or a structural isomer thereof; a catalyst-imparting treatment solution for electroless plating, comprising the palladium complex or the isomer as an active ingredient; and a method for formation of a metal plating coating film on a non-conductive resin, comprising the steps of subjecting a non-conductive resin having an anionic group formed on its surface to a catalyst-imparting treatment with the catalyst-imparting treatment solution and then performing reduction treatment, electroless metal plating and electrolytic plating. (I) wherein L represents an alkylene group; and R represents an amino group or a guanidyl group.</p> |
申请公布号 |
WO2007066460(A1) |
申请公布日期 |
2007.06.14 |
申请号 |
WO2006JP321941 |
申请日期 |
2006.11.02 |
申请人 |
EBARA-UDYLITE CO., LTD.;KOHTOKU, MAKOTO;HAMADA, MIKA |
发明人 |
KOHTOKU, MAKOTO;HAMADA, MIKA |
分类号 |
C23C18/28;C07C229/08;C07C229/22;C07C229/24;C07C229/26;C07C279/14;C07F15/00 |
主分类号 |
C23C18/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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