| 发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition excellent in sensitivity and resolution. <P>SOLUTION: The positive photosensitive resin composition contains 100 parts by mass of a hydroxypolyamide having a repeating unit represented by formula (1), 0.01-50 parts by mass of a urethane compound and 1-50 parts by mass of a photoacid generator. <P>COPYRIGHT: (C)2007,JPO&INPIT |
| 申请公布号 |
JP2007148323(A) |
申请公布日期 |
2007.06.14 |
| 申请号 |
JP20060050622 |
申请日期 |
2006.02.27 |
| 申请人 |
ASAHI KASEI ELECTRONICS CO LTD |
发明人 |
SHIBUI TOMOHITO |
| 分类号 |
G03F7/022;C08G73/22;G03F7/004;H01L21/027 |
主分类号 |
G03F7/022 |
| 代理机构 |
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| 主权项 |
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| 地址 |
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