| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of improving a transfer rate between chips without incurring noise or crosstalk. <P>SOLUTION: An input/output circuit (input circuit 27, 37 and output circuit 26, 36) is provided for each connecting pad 21, 31 for attaining a connection between a storage device chip 20 and the outside of an ASIC 30 (between mutual chips) and these input/output circuits are disposed in an array shape (grid shape in the present embodiment). Namely, unit cell areas 25, 35 including the input/output circuits are disposed in an array shape to configure an I/O array (input/output area 24, 34). The storage device chip 20 and the ASIC 30 are then mounted on both sides of a wiring chip 10 while facing the I/O arrays (input/output areas 24, 34) each other. <P>COPYRIGHT: (C)2007,JPO&INPIT |
