发明名称 INSPECTION METHOD OF ANODIC BONDING
摘要 PROBLEM TO BE SOLVED: To effectively inspect the positional deviation of the glass, in the inspection method of the anodic bonding of the acceleration sensor in which the glass is anodically-bonded to the silicon substrate. SOLUTION: The lands 9a-9d for inspection are provided, by exposing both the end parts of the anodic bonding pattern 9 for probe inspection of the anodic bonding toward the outside from the bonding position 10, each resistance value between the inspection lands 9a-9b or 9c-9d, the resistance difference between the two pairs of resistance differences between inspection lands 9a-9b and 9c-9d, and the sheet resistance and pattern shape of the anodic bonding pattern 9 for probe inspection, the positional deviation of the anodic bonding can be inspected electrically in an effective manner. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007147392(A) 申请公布日期 2007.06.14
申请号 JP20050340833 申请日期 2005.11.25
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KAMI HIRONORI
分类号 G01P15/08 主分类号 G01P15/08
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