发明名称 Computer chassis for improved airflow and heat transfer from computer system components
摘要 The present invention pertains to a computer chassis with improved airflow to reduce the occurrence of trapped air pockets and increase heat transfer from components within the chassis. The computer chassis includes a plurality of chambers, wherein each of the chambers is separated by a partition. The partitions are operable to reduce the occurrence of trapped air pockets and increase heat transfer from components of the chassis by causing air to flow through each of the chambers. The computer chassis further includes at least two air vents, wherein each of the chambers is coupled to at least one of the at least two air vents through which air enters the chamber, and wherein each of the chambers is coupled to at least one of the at least two air vents through which air exits the chamber.
申请公布号 US2007133167(A1) 申请公布日期 2007.06.14
申请号 US20050299056 申请日期 2005.12.09
申请人 WAGNER BARRY A;LE DON;TSU WILLIAM P 发明人 WAGNER BARRY A.;LE DON;TSU WILLIAM P.
分类号 H05K7/20 主分类号 H05K7/20
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