发明名称 |
GLASS PACKAGE THAT IS HERMETICALLY SEALED WITH A FRIT AND METHOD OF FABRICATION |
摘要 |
<p>A hermetically sealed glass package preform is provided comprising a glass substrate; a frit comprising 65 - 100 wt.% of a base glass and about 0 - 35 wt.% of a filler; wherein the base glass comprises: about 0 - 5 mole % K<SUB>2</SUB>O; about 0 - 35 mole % Sb<SUB>2</SUB>O<SUB>3</SUB>; about 0 - 20 mole % ZnO; about 10 - 40 mole % P<SUB>2</SUB>O<SUB>5</SUB>; about 10 - 60 mole % V<SUB>2</SUB>O<SUB>5</SUB>; about 0 - 5 mole % TiO<SUB>2</SUB>; about 0 - 5 mole % B<SUB>2</SUB>O<SUB>3</SUB>; about 0 - 5 mole % SiO<SUB>2</SUB>; about 0 - 5 mole% WO<SUB>3</SUB>; and about 1- 10 mole % of a metal oxide selected from the group consisting of Fe<SUB>2</SUB>O<SUB>3</SUB>, Nd<SUB>2</SUB>O<SUB>3</SUB>, La<SUB>2</SUB>O<SUB>3</SUB>, Ce<SUB>2</SUB>O<SUB>4</SUB>, Pr<SUB>6</SUB>O<SUB>11</SUB>, Er<SUB>2</SUB>O<SUB>3</SUB>, and CeO<SUB>2</SUB>; wherein the base glass has a mean particle size distribution of less than about 3 µm; and wherein the filler has a mean particle size distribution of between about 3 and 7 µm. The frit is sintered in an atmosphere less oxidizing than air at a temperature of between about 39O °C to 415 °C.</p> |
申请公布号 |
WO2007067402(A2) |
申请公布日期 |
2007.06.14 |
申请号 |
WO2006US45744 |
申请日期 |
2006.11.28 |
申请人 |
CORNING INCORPORATED;LAMBERSON, LISA, A.;MORENA, ROBERT, M. |
发明人 |
LAMBERSON, LISA, A.;MORENA, ROBERT, M. |
分类号 |
C03B23/20 |
主分类号 |
C03B23/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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