发明名称 |
Verfahren zur Herstellung einer Platte von gekapselten integrierten Schaltkreisen und Form zum Kapseln eines plattenförmigen Substrats von integrierten Schaltkreisen |
摘要 |
A method and an apparatus for forming a panel of packaged integrated circuits is disclosed. A substrate panel having an array of integrated circuits mounted thereon is placed in a mold having a molding chamber. The molding chamber has a multiplicity of adjacent package recesses flowably interconnected by way of a plurality of molding compound flowgates. Each package recess is suitable for receiving at least one associated integrated circuits. A molding compound is passed into the molding chamber by way of a mold gate such that at least some of the molding compound passes through a plurality of different package recesses by way of their associated flowgates. In one embodiment, the mold includes a mold body having a molding chamber with a plurality of ridges that define the multiplicity of package recesses within the molding chamber. The multiplicity of package recesses are flowably interconnected through flowgates formed by the ridges. |
申请公布号 |
DE19837336(B4) |
申请公布日期 |
2007.06.14 |
申请号 |
DE1998137336 |
申请日期 |
1998.08.18 |
申请人 |
NATIONAL SEMICONDUCTOR CORP. |
发明人 |
LEE, SHAW WEI;TAKIAR, HEM P.;DRUMMOND, FRED |
分类号 |
H01L21/52;B29C39/26;H01L23/544;H05K3/30 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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