| 摘要 |
A semiconductor chip (7) made as part of a semiconductor wafer will form a discrete semiconductor component (1), for connection to a higher-order circuit substrate or circuit board. For this purpose, the chip (or component) has connection elements (6). A coplanar surface (9) of the semiconductor component includes upper surfaces of the connection elements (6) and a plastic mass (11). The connection element has a mesa structure (12), or is mushroom-shaped, for surface mounting. It comprises a structured, lead-free coating. Connection elements are arranged on contact areas of the semiconductor chip. The planar extent of the connection elements corresponds with the contact areas of the semiconductor chip. The lead-free contact coating (14) is a zinc-silver or zinc-gold solder mixture. The connection element is an under-bump metallization (UBM) layer with TiW. Its thickness (d) is 5-50 mu m. It is an electroplated, micro-crystalline structured metal. The semiconductor component (1) is a semiconductor diode, semiconductor transistor, optical diode and/or high frequency transistor. Preferred dimensions of the semiconductor component (length x width x height) are: 0.6 x 0.3 x 0.4 mm. An electrically-conductive nucleation layer is sputtered or vapor-deposited onto the upper surface of the wafer. Areas which will not be coated are masked. Further processes employed, comprise one or more of photolithography, jet printing, solvent application, plasma etching, wet etching. The chips are sawn from the wafer on a separation film. The chips are held on a packaging film (e.g. a bandolier). To increase spacing between them, the film is heated. The chips, now forming separate components, are embedded and the coplanar surface is formed, using an injection-molding technique, especially compression molding. Laser ablation separates the composite plate into individual semiconductor components. The wafer is expanded from the rear before chip separation, but first, their function is tested in situ and/or in the composite form. An independent claim IS INCLUDED FOR the corresponding method of manufacture. |
