| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an image sensor module and camera module package which eliminates a defect rate in picture embodiment. <P>SOLUTION: An image sensor module comprises: an image sensor 33 including a pixel region picking up an image inputted from the outside, and a signal processing region having bumps formed in the outer portion of the image sensor so as to process an electrical signal with respect to the image picked up by the pixel region; and a board 31 attached to the image sensor by a liquid adhesive and provided with a window 32 such that the pixel region of the image sensor receives light. The board 31 includes: a dummy pattern 36, 37 formed on at least a portion around the window; a circuit pattern 35 formed in a position spaced in a predetermined distance outward from the dummy pattern; and board-side pads 34 electrically connected to the circuit pattern so as to come in contact with the bumps formed in the image sensor. <P>COPYRIGHT: (C)2007,JPO&INPIT |
