| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting apparatus which can easily replace a vacant tray with no semiconductor chips left over with a new one, when mounting semiconductor chips stored in a plurality of trays on a substrate. <P>SOLUTION: The mounting apparatus comprises a substrate transfer means for transferring and positioning a substrate, a component supply means 1 for supplying a tray 106 which stores semiconductor chips to a supply stage 2, and a mounting tool which fetches the semiconductor chips from the tray supplied to the supply stage by the component supply means and then mounts them on the substrate. The component supply means includes a plurality of tray stackers 105 wherein the trays storing different types of semiconductor chips are so set up as to be taken in and put out; and a plurality of conveyor units 101 for transferring trays which are installed integrally with the supply stage, selectively supply, and transfer the trays storing different types of semiconductor chips out of the individual tray stackers, and collect and transfer vacant trays to the tray stackers from which they have been taken out. <P>COPYRIGHT: (C)2007,JPO&INPIT |
