发明名称 ELECTROLESS GOLD PLATING SOLUTION AND ELECTROLESS GOLD PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electroless gold plating solution giving the high precipitation rate of gold, and having excellent stability even in neutral conditions and at low temperatures. SOLUTION: The electroless gold plating solution contains a gold salt, a reducing agent expressed by general formula (I) and a heavy metal salt; in the formula, R<SP>1</SP>is a hydroxyl group or an amino group; and R<SP>2</SP>, R<SP>3</SP>and R<SP>4</SP>are each individually a hydroxyl group, an amino group, a hydrogen atom or an alkyl group. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007146302(A) 申请公布日期 2007.06.14
申请号 JP20070062490 申请日期 2007.03.12
申请人 HITACHI CHEM CO LTD 发明人 TAKAHASHI AKIO;YAMAMOTO HIROSHI;MURAKAMI KANJI
分类号 C23C18/44 主分类号 C23C18/44
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