| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate comprising a thin-film pattern layer. SOLUTION: This method for manufacturing a substrate comprising a thin-film pattern layer comprises the step of providing a preformed substrate comprising a plurality of ink-repellent partition walls, a housing space being provided between adjacent partition walls, the step of delivering an ink containing a solidifiable component into the plurality of housing spaces, the volume of ink received each of the housing spaces being larger than the volume of the housing space, and the step of solidifying the ink and forming a thin-film pattern layer, by the solidifiable component in the ink, in the housing space. Since the height of the thin-film pattern layer is substantially equal to that of the partition wall, there is no need to polish the partition wall and the thin-film pattern layer by polishing and etching and a demand for high evenness can be satisfied. COPYRIGHT: (C)2007,JPO&INPIT
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