发明名称 Inhibiting underfill flow using nanoparticles
摘要 A method and apparatus for inhibiting the flow of a flowable adhesive material disposed adjacent to a substrate. A chip component is disposed adjacent to a substrate and a plurality of nanoparticles are disposed and cured adjacent to the substrate and proximate to the chip component. The nanoparticles possess surface properties that make them substantially immiscible with a flowable adhesive. The band of nanoparticles will inhibit the flow of a flowable adhesive material disposed between the chip and the nanoparticles, in a direction bounded by the plurality of nanoparticles, while adhesive flow in the direction of the component is promoted.
申请公布号 US2007134937(A1) 申请公布日期 2007.06.14
申请号 US20050304510 申请日期 2005.12.14
申请人 INTEL CORPORATION 发明人 SEE CHUN H.;LIM SZU S.
分类号 H01L21/31 主分类号 H01L21/31
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