发明名称 COOLING METHOD OF GLASS SUBSTRATE AND PREBAKE DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a cooling method of glass substrate and a prebake device which will not cause creaks or breakages upon the release of vacuum suction, even if a glass substrate is caused to come into close contact with a cooling plate by vacuum suction and then is cooled. <P>SOLUTION: In the cooling method of glass substrate, the fall of a lift pin 23 is once stopped at a position where the glass substrate 60 approaches the cool plate 21, the fall of the lift pin 23 is resumed, when temperature of the glass substrate approaches the temperature of the cooling plate, the glass plate is placed on the cool plate and the close contact cooling performed by vacuum suction is continued. The prebake device is provided with a mechanism for temporarily stopping the fall of the lift pin; a mechanism for resuming of the fall; and a mechanism for continuing the close contact cooling through vacuum adsorption. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007147832(A) 申请公布日期 2007.06.14
申请号 JP20050339996 申请日期 2005.11.25
申请人 TOPPAN PRINTING CO LTD 发明人 SUDO SEIJI;ASAO YOSHIKAZU;HORI KIICHI;SEKO TETSUTSUGU
分类号 G02B5/20;C03B25/02;G02F1/13;G02F1/1333 主分类号 G02B5/20
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