发明名称 RESIN COMPOSITION AND RESIN-SEALED SEMICONDUCTOR DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a resin composition which gives cured articles having excellent transparency, and has good storage stability. <P>SOLUTION: This resin composition is characterized by comprising a resin component and a curing catalyst comprising a phenolic compound and an aluminum complex, wherein the resin component comprises an epoxy resin represented by the general formula (1) in an amount of 70 to 95 wt.% and a both terminal-epoxidized silicone resin in at least one part of the remainder. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007145939(A) 申请公布日期 2007.06.14
申请号 JP20050340253 申请日期 2005.11.25
申请人 TOSHIBA CORP 发明人 MURAI SHINJI;SAITO SATOSHI;ASAKAWA KOUJI
分类号 C08G59/20;C08G59/62;C08G59/70;H01L23/29;H01L23/31 主分类号 C08G59/20
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