| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition which little contracts, when cured, and has excellent adhesiveness to substrates. SOLUTION: This curable resin composition of the present invention is characterized by comprising an alicyclic epoxy compound represented by structural formula (1) and a cation polymerization initiator or a curing agent. The cation polymerization initiator includes heat cation polymerization initiators and photo cation polymerization initiators. These initiators may be used singly or in a combination of two or more initiators. A multi-basic acid anhydride may be used as the curing agent. The alicyclic epoxy compound represented by structural formula (1) is preferably an alicyclic epoxy compound having a free chlorine content of≤50 wt. ppm. COPYRIGHT: (C)2007,JPO&INPIT |
