APPARATUS FOR TRANSFERRING SUBSTRATE AND EQUIPMENT FOR FABRICATING SEMICONDUCTOR DEVICE EMPLOYING THE SAME

摘要

A substrate transfer apparatus and semiconductor device manufacturing equipment including the same are provided to support different sized substrates without changing a substrate supporting unit by employing a multi-layer structured placing plate. A main arm(120) rotates on a horizontal surface. A frame unit(130) is arranged on an end of the main arm. A substrate supporting unit(140) moves along the frame unit and is expanded and contracted according to a size of the substrate. Both sides of the substrate supporting unit are symmetrical to each other. A multi-layer structured placing plate is formed on the substrate supporting unit to support different sized substrates. The placing plate includes a first placing plate(141) for supporting a first substrate and a second placing plate(144) for supporting a second substrate smaller than the first substrate.