| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a side view LED package for a backlight unit, the emitted light of which has improved the orientation angle characteristics and increased light emission quantity, and in which the molding defects of the sidewall can be prevented. <P>SOLUTION: A side view LED package 100 for a backlight unit comprises a package body 106 that has a cavity C with a bottom surface and an inner sidewall 107, inclined upward; first and second lead frames 104 that are formed in the package body so as to be exposed on the bottom surface of the cavity; a light-emitting diode chip 102 that is mounted on the bottom surface of the cavity so as to be electrically connected to the first and second lead frames; and a transparent encapsulant 108, that is formed in the cavity so as to surround the light-emitting diode chip. The cavity has a depth d that larger than the mounting height h11+h12 of the light-emitting diode chip and will not exceed six times the mounting height. <P>COPYRIGHT: (C)2007,JPO&INPIT |
