发明名称 |
THERMAL ISOLATION BETWEEN HEATING AND SENSING FOR FLOW SENSORS |
摘要 |
A flow sensor system includes a plurality of flow sensor chips, wherein each flow sensor chip among the plurality of flow sensor chips comprises a substrate, a heater element, a heater control circuit, and flow sensor component formed on the substrate, wherein the heater element is disposed separately from the heater control circuit on the substrate, wherein the heater control circuit is thermally isolated from the heater element and the flow sensor component. Additionally, an air gap can be formed between each sensor chip among the plurality of flow sensor chips, wherein the plurality of flow sensor chips comprises a flow sensor system in which each of the flow sensor chips are separated from one another by the air gap formed therebetween in order to reduce output distortion, response time, warm-up time, drift and noise associated with the plurality of flow sensor chips. |
申请公布号 |
WO2007067607(A2) |
申请公布日期 |
2007.06.14 |
申请号 |
WO2006US46530 |
申请日期 |
2006.12.06 |
申请人 |
HONEYWELL INTERNATIONAL INC.;GEHMAN, RICHARD, W.;MARCHINI, MICHAEL, G.;MURRAY, MARTIN, G. |
发明人 |
GEHMAN, RICHARD, W.;MARCHINI, MICHAEL, G.;MURRAY, MARTIN, G. |
分类号 |
G01F1/684 |
主分类号 |
G01F1/684 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|